MediaTek Launches “Cool 3D”: A Comprehensive Suite of 3D Solutions for Smartphone Platforms

TAIWAN, Hsinchu – 11 September, 2012 – MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions announced today the availability of... 更多消息

2012 年 9 月 11 日 - 下午 2:04

MediaTek Launches the 2nd Generation ULC Mobile Phone Single Chip

TAIWAN, Hsinchu – 31 August, 2012 – MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions announced today the debut of its MT6250, an... 更多消息

2012 年 8 月 31 日 - 下午 2:07

Ralink is Part of the Wi‐Fi Alliance Test Bed for Wi‐Fi CERTIFIED TDLS and Among the Very First Products to Achieve Certification

TAIWAN, Hsinchu – 24 August, 2012 – MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, today applauded the introduction of the... 更多消息

2012 年 8 月 24 日 - 下午 2:10

新聞稿

MediaTek Launches “Cool 3D”: A Comprehensive Suite of 3D Solutions for Smartphone Platforms

MediaTek Launches the 2nd Generation ULC Mobile Phone Single Chip

Ralink is Part of the Wi‐Fi Alliance Test Bed for Wi‐Fi CERTIFIED TDLS and Among the Very First Products to Achieve Certification

MediaTek Inc. Corporate Announcement

MediaTek Inc. and MStar Semiconductor, Inc. Announce Merger Agreement

MediaTek Announces Global Partnership to Bring Twitter to ‘Smart-Feature Phones’

MediaTek Provides First and Only Smartphone Platform in the Wi-Fi CERTIFIED Passpoint Program Test Bed

MediaTek Launches Dual-Core MT6577 Smartphone Platform

MediaTek Inc. Announces Tender Offer for MStar Semiconductor, Inc.

MediaTek First to Bring 802.11ac 1T1R